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Luosi WEI, Zongxia JIAO
《机械工程前沿(英文)》 2009年 第4卷 第2期 页码 184-191 doi: 10.1007/s11465-009-0034-9
关键词: machine vision visual location solder paste printing VisionPro
Multiscale mechanical modeling of hydrated cement paste under tensile load using the combined DEM-MD
Yue HOU, Linbing WANG
《结构与土木工程前沿(英文)》 2017年 第11卷 第3期 页码 270-278 doi: 10.1007/s11709-017-0408-8
《结构与土木工程前沿(英文)》 2021年 第15卷 第4期 页码 1025-1037 doi: 10.1007/s11709-021-0741-9
关键词: cemented paste backfill fiber reinforcement constitutive behavior temperature tailings
Detection of solder bump defects on a flip chip using vibration analysis
Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO
《机械工程前沿(英文)》 2012年 第7卷 第1期 页码 29-37 doi: 10.1007/s11465-012-0314-7
Flip chips are widely used in microelectronics packaging owing to the high demand of integration in IC fabrication. Solder bump defects on flip chips are difficult to detect, because the solder bumps are obscured by the chip and substrate. In this paper a nondestructive detection method combining ultrasonic excitation with vibration analysis is presented for detecting missing solder bumps, which is a typical defect in flip chip packaging. The flip chip analytical model is revised by considering the influence of spring mass on mechanical energy of the system. This revised model is then applied to estimate the flip chip resonance frequencies. We use an integrated signal generator and power amplifier together with an air-coupled ultrasonic transducer to excite the flip chips. The vibrations are measured by a laser scanning vibrometer to detect the resonance frequencies. A sensitivity coefficient is proposed to select the sensitive resonance frequency order for defect detection. Finite element simulation is also implemented for further investigation. The results of analytical computation, experiment, and simulation prove the efficacy of the revised flip chip analytical model and verify the effectiveness of this detection method. Therefore, it may provide a guide for the improvement and innovation of the flip chip on-line inspection systems.
关键词: flip chip defect detection ultrasonic excitation vibration analysis
《结构与土木工程前沿(英文)》 2023年 第17卷 第2期 页码 256-270 doi: 10.1007/s11709-022-0924-z
关键词: fiber reinforcement cemented paste backfill fracture behavior underground mine cement hydration
A potentiometric cobalt-based phosphate sensor based on screen-printing technology
Lei ZHU,Xiaohong ZHOU,Hanchang SHI
《环境科学与工程前沿(英文)》 2014年 第8卷 第6期 页码 945-951 doi: 10.1007/s11783-013-0615-z
关键词: phosphate cobalt screen-printing technology electroplate wastewater
《结构与土木工程前沿(英文)》 页码 1295-1309 doi: 10.1007/s11709-023-0999-1
关键词: particle-based simulation liquid bridge force rheological property 3D printing mortar extrudability constructability
《能源前沿(英文)》 2022年 第16卷 第4期 页码 542-547 doi: 10.1007/s11708-022-0834-8
陶瓷喷墨打印增材制造技术 Review
Brian Derby
《工程(英文)》 2015年 第1卷 第1期 页码 113-123 doi: 10.15302/J-ENG-2015014
陶瓷喷墨打印是一种基于微滴累加的成形技术,典型的微滴体积为10~100 pL。实现微滴累加成形的关键是开发稳定的陶瓷墨水,合适的墨水需要满足由雷诺数和韦伯数定义的流变特性参数空间。在微滴累加成形过程中,微滴首先与成形面碰撞变形并消耗动能,然后在毛细管力作用下铺展并达到平衡状态。已经可以确定的是打印过程中微滴相互作用并形成一维线性特征的机理,但是对二维和三维结构成形机理的认识还处于较低水平,成形二维面的稳定性低于成形一维线性结构。多数情况下,墨水通过蒸发固化,微滴碰撞基体所产生的“咖啡环”缺陷需要通过固化工艺加以控制。已经有大量文献报道了使用喷墨打印技术成形各种类型小型陶瓷零件的成功案例。作为一种未来的制造技术,陶瓷喷墨打印技术有广阔的应用前景。本综述的目的是探索陶瓷喷墨打印技术未来潜在的研究领域,加强对这种制造方法的理解。
Elena CERRO-PRADA,Miguel MANSO,Vicente TORRES,Jesús SORIANO
《结构与土木工程前沿(英文)》 2016年 第10卷 第2期 页码 189-197 doi: 10.1007/s11709-015-0326-6
关键词: cement composites photocatalytic TiO2 sol-gel C-S-H gel microstructure
对双层组件4D打印可逆性的初步研究 Article
Amelia Yilin Lee, Jia An, Chee Kai Chu, Yi Zhang
《工程(英文)》 2019年 第5卷 第6期 页码 1159-1170 doi: 10.1016/j.eng.2019.09.007
增材制造的快速发展和形状记忆聚合物材料的进步推动了四维(4D)打印技术的进展。随着设计方面的不断改进,逐渐证明有可能实现可逆4D打印或双向4D打印。这项技术将完全消除对人为干预的需要,因为编程完全由外部刺激驱动,这使得4D打印部件可以在多个周期内启动。本研究提出了一种新的可逆4D打印驱动方法,其中弹性体的溶胀和热量用于编程阶段,以及热量用于恢复阶段。本研究的主要重点在于自驱动设计这一步骤。为了实现对弯曲的控制,已经开发了一种简单的预测模型用于研究曲率。此外,为了更好地了解模型对曲率的预测程度,对参数、温度和弹性体厚度也进行了研究。采用这种方式理解曲率可以提供对可逆4D打印结构的高度控制。
《环境科学与工程前沿(英文)》 2021年 第15卷 第5期 doi: 10.1007/s11783-021-1390-x
•PSBF performed better than PAC and PAM in CODCr removals.
关键词: Practical wastewater treatment Commercial coagulant/flocculant Secondary coagulation-flocculation process Chemical oxygen demand Coagulation-flocculation mechanism
Process development for green part printing using binder jetting additive manufacturing
Hadi MIYANAJI, Morgan ORTH, Junaid Muhammad AKBAR, Li YANG
《机械工程前沿(英文)》 2018年 第13卷 第4期 页码 504-512 doi: 10.1007/s11465-018-0508-8
Originally developed decades ago, the binder jetting additive manufacturing (BJ-AM) process possesses various advantages compared to other additive manufacturing (AM) technologies such as broad material compatibility and technological expandability. However, the adoption of BJ-AM has been limited by the lack of knowledge with the fundamental understanding of the process principles and characteristics, as well as the relatively few systematic design guideline that are available. In this work, the process design considerations for BJ-AM in green part fabrication were discussed in detail in order to provide a comprehensive perspective of the design for additive manufacturing for the process. Various process factors, including binder saturation, in-process drying, powder spreading, powder feedstock characteristics, binder characteristics and post-process curing, could significantly affect the printing quality of the green parts such as geometrical accuracy and part integrity. For powder feedstock with low flowability, even though process parameters could be optimized to partially offset the printing feasibility issue, the qualities of the green parts will be intrinsically limited due to the existence of large internal voids that are inaccessible to the binder. In addition, during the process development, the balanced combination between the saturation level and in-process drying is of critical importance in the quality control of the green parts.
关键词: binder jetting additive manufacturing green part process optimization process development
增材制造(3D打印)发展趋势 Perspective
卢秉恒, 李涤尘, 田小永
《工程(英文)》 2015年 第1卷 第1期 页码 85-89 doi: 10.15302/J-ENG-2015012
增材制造又称为3D打印,在过去30年间取得了快速发展并展示出前所未有的发展潜力。同时,这项发展潜力巨大的技术对传统工业也产生了不可估量的影响。3D打印技术将会推动生产模式的变革,通过实现5个“任意”的工艺发展,将会为制造行业带来一个以定制化制造为特征的新时代。3D打印的技术进步及其与传统制造工艺的融合,将推动制造业在材料研发、产品设计、生产工艺等方面进一步创新发展。最终,3D打印技术将与等材制造、减材制造形成三足鼎立局面,共同分享整个社会的制造业价值。
An investigation into the properties of ternary and binary cement pastes containing glass powder
Marcelo Frota BAZHUNI, Mahsa KAMALI, Ali GHAHREMANINEZHAD
《结构与土木工程前沿(英文)》 2019年 第13卷 第3期 页码 741-750 doi: 10.1007/s11709-018-0511-5
关键词: cement paste glass powder pozzolanic reaction supplementary cementitious material
标题 作者 时间 类型 操作
Research and application of visual location technology for solder paste printing based on machine vision
Luosi WEI, Zongxia JIAO
期刊论文
Multiscale mechanical modeling of hydrated cement paste under tensile load using the combined DEM-MD
Yue HOU, Linbing WANG
期刊论文
temperature-dependence of compressive and tensile behaviors of polypropylene fiber-reinforced cemented paste
期刊论文
Detection of solder bump defects on a flip chip using vibration analysis
Junchao LIU, Tielin SHI, Qi XIA, Guanglan LIAO
期刊论文
Experimental investigation of evolutive mode-I and mode-II fracture behavior of fiber-reinforced cemented paste
期刊论文
A potentiometric cobalt-based phosphate sensor based on screen-printing technology
Lei ZHU,Xiaohong ZHOU,Hanchang SHI
期刊论文
forces on rheological properties, and resulting extrudability and constructability of three-dimensional printing
期刊论文
Liquid metal printing opening the way for energy conservation in semiconductor manufacturing industry
期刊论文
Microstructural and photocatalytic characterization of cement-paste sol-gel synthesized titanium dioxide
Elena CERRO-PRADA,Miguel MANSO,Vicente TORRES,Jesús SORIANO
期刊论文
Flocculation behaviors of a novel papermaking sludge-based flocculant in practical printing and dyeing
期刊论文
Process development for green part printing using binder jetting additive manufacturing
Hadi MIYANAJI, Morgan ORTH, Junaid Muhammad AKBAR, Li YANG
期刊论文